化学机械平面化
材料科学
抛光
扫描电子显微镜
紫外线
辐照
复合材料
透射电子显微镜
拉曼光谱
磨料
磨损(机械)
化学工程
纳米技术
光学
光电子学
物理
核物理学
工程类
作者
Zihan Kou,Chao Wang,Wenjin Zhou,Ailian Chen,Yang Chen
标识
DOI:10.1016/j.apsusc.2024.159733
摘要
Ceria (CeO2)-based abrasives are widely utilized in ultra-precision grinding and chemical mechanical polishing (CMP) applications over silica materials due to their unique physicochemical properties. Both mechanical and chemical contributions to polishing processes are highly affected by the size, shape, structure, component, defect of CeO2 abrasives. Herein, the composites involved mesoporous silica (mSiO2) cores and La- or Yb-doped CeO2 shells were synthesized and characterized in terms of X-ray diffractometry, scanning electron microscopy, transmission electron microscopy, Raman spectroscopy, scanning transmission electron microscopy–energy dispersive X-ray mapping methods. The polishing effectiveness of the proposed composites toward quartz glass was experimentally evaluated under both CMP and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP) conditions. The polishing results indicated that the low-modulus mSiO2 cores strongly exerted the cushion effects for the friction and abrasion to substrates. Consequently, the heterostructured mSiO2/La-CeO2 and mSiO2/Yb-CeO2 abrasive systems offered nearly non-damage and ultra-smooth surfaces with angstrom-level roughness compared to conventional rigid abrasives. The enriched Ce3+ and oxygen vacancy defects at La- and Yb- doped CeO2 surfaces were responsible for the improvements of tribochemical and photochemical activities, thus allowing evidently enhanced removal efficiency with the assistance of ultraviolet irradiation. A possible polishing mechanism on the multi-component abrasive systems was also proposed.
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