Recent advances in piezoelectric and triboelectric self-powered sensors for human-machine interface applications

摩擦电效应 压电 接口(物质) 纳米发生器 人机界面 工程类 纳米技术 电气工程 材料科学 计算机科学 机械工程 人机系统 人机交互 复合材料 毛细管数 毛细管作用
作者
Lei Du,Yulong Li,Ruizhe Qiu,Jiaxing Xu,Kai Nie,Xinyu Cao,Jiaqi Tang,Yiqing Wang,Gang Du,Ling Bu
出处
期刊:Journal of Micromechanics and Microengineering [IOP Publishing]
卷期号:34 (9): 093001-093001
标识
DOI:10.1088/1361-6439/ad6778
摘要

Abstract The burgeoning internet of things and artificial intelligence technologies have prospered a variety of emerging applications. Human–machine interfaces (HMIs), for instance, enables users with intuitive, efficient, and friendly way to interact with machines, capable of instant information acquisition, processing, communication, and feedback, etc. These features require ultra-compact and high-performance transducers, and therefore self-powered sensors have become the key underlying technology for HMI applications. This review focuses on the piezoelectric, triboelectric, and hybrid self-powered sensors with particular attention to their microstructures and fabrication methods, showing that both traditional microfabrication and emerging fabrication methods like three-dimensional (3D) printing, electrospinning, and braiding have contributed to the planar, array, porous, fabric, and composite type self-powered sensors. Moreover, the integration method of piezoelectric and triboelectric sensor arrays is investigated. The crosstalk issue is highlighted, i.e. the signal interference between adjacent sensing units, and current solutions such as array design optimization, signal processing improvement, and material innovation to reduce crosstalk sensitivity have been reviewed through specific examples. Three categories of HMI applications have been outlined, including intelligent interaction, robotics, and human monitoring, with detailed explanations of how the self-powered sensors support these HMI applications. Through discussion of challenges and prospects, it is proposed that further coordinating the design and fabrication of micro devices with HMIs will potentially boost the intelligent application with even higher level of diversification, convenience, and interconnectivity.

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