太赫兹辐射
飞秒
烧蚀
硅
激光器
材料科学
激光烧蚀
光学
光电子学
超快光学
物理
工程类
航空航天工程
标识
DOI:10.1364/jsapo.2023.19p_b205_8
摘要
In recent years, laser processing with GHz and THz bursts of femtosecond pulses has attracted great attention to improving the efficiency of laser-induced microfabrication [3, 4]. The efficient absorption of laser energy in the GHz burst and the heat-accumulation effect have been proposed as the main mechanisms for ablation enhancement [3-5]. However, the possible mechanisms have not yet been fully elucidated and more investigations are needed. Therefore, in this study, we used COMSOL Multiphysics to simulate the GHz and THz burst mode femtosecond laser ablation of silicon and investigate the responsible mechanisms of the ablation efficiency enhancement.
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