热电冷却
数码产品
热电效应
炸薯条
电子设备和系统的热管理
热电材料
可控性
可靠性(半导体)
机械工程
计算机科学
工程类
材料科学
电气工程
物理
热力学
功率(物理)
数学
量子力学
应用数学
作者
Wenyi Chen,Xiao‐Lei Shi,Jin Zou,Zhi‐Gang Chen
标识
DOI:10.1016/j.mser.2022.100700
摘要
Compared with traditional active cooling methods, thermoelectric coolers are more accessible to be integrated with electronics as an effective thermal management solution due to their reliability, silence, compatibility, and controllability. Considering the rapid development of processors and chips in electronics, this work comprehensively reviews the progress of state-of-the-art on-chip thermoelectric coolers and summarizes the related fundamentals, materials, designs, and system logic. Particularly, we highlight on-chip thermoelectric coolers with self-cooling design and on-demand requirement. In the end, we point out current challenges and opportunities for future improvement of designs, performance, and applications of on-chip thermoelectric coolers.
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