Screen-Printable Cu–Ag Core–Shell Nanoparticle Paste for Reduced Silver Usage in Solar Cells: Particle Design, Paste Formulation, and Process Optimization

Copper–silver (Cu–Ag) core–shell nanoparticles are promising for replacing the silver particles and flakes used in printed conductors in current solar cells since they deliver good conductivity, chemical stability, and optical performance, while also reducing the silver content, thus significantly impacting the cost. The bare nanoparticles offer excellent air stability thanks to the silver-covered copper structure. We demonstrate a screen-printable paste for use in solar cell conductor applications. We report a printed morphology and light reflection properties similar to those achieved with commercial silver pastes. The reported Cu–Ag core–shell paste is uniquely formulated with an epoxy binder and an aliphatic hardener, delivering significantly improved electrical conductivity, while simultaneously reducing the overall silver content by ∼36 wt %. This is attributable to the cross-linked polymeric structure, low-temperature conversion, and improved loading of conductive core–shell nanoparticles. As needed for contact formation in conventional top-contact silicon solar cells, the paste is additionally loaded with lead bisilicate and delivers conductivity on par with that of commercial silver paste. Thus, by combining the reduction of the silver content with excellent electronic and optical properties, this Cu–Ag nanoparticle-based paste becomes attractive for low-cost printed-conductor applications, including photovoltaics and electronics.