Morphology Control and Mechanism of Different Bath Systems in Cu/SiCw Composite Electroplating

络腮胡子 胡须 镀铜 电镀(地质) 材料科学 复合数 电镀 复合材料 涂层 单晶晶须 碳化硅 冶金 图层(电子) 地质学 地球物理学
作者
Bing Niu,Dongdong Xie,Yanxin Zhang,Yuxiao Bi,Yigui Li,Guifu Ding,Liyan Lai
出处
期刊:Nanomaterials [MDPI AG]
卷期号:14 (12): 1043-1043
标识
DOI:10.3390/nano14121043
摘要

With the rapid development of electronic technology and large-scale integrated circuit devices, it is very important to develop thermal management materials with high thermal conductivity. Silicon carbide whisker-reinforced copper matrix (Cu/SiCw) composites are considered to be one of the best candidates for future electronic device radiators. However, at present, most of these materials are produced by high-temperature and high-pressure processes, which are expensive and prone to interfacial reactions. To explore the plating solution system suitable for SiCw and Cu composite electroplating, we tried two different Cu-based plating solutions, namely a Systek UVF 100 plating solution of the copper sulfate (CuSO4) system and a Through Silicon Via (TSV) plating solution of the copper methanesulfonate (Cu(CH3SO3)2) system. In this paper, Cu/SiCw composites were prepared by composite electrodeposition. The morphology of the coating under two different plating liquid systems was compared, and the mechanism of formation of the different morphologies was analyzed. The results show that when the concentration of SiCw in the bath is 1.2 g/L, the surface of the Cu/SiCw composite coating prepared by the CuSO4 bath has more whiskers with irregular distribution and the coating is very smooth, but there are pores at the junction of the whiskers and Cu. There are a large number of irregularly distributed whiskers on the surface of the Cu/SiCw composite coating prepared with the copper methanesulfonate (Cu(CH3SO3)2) system. The surface of the composite is flat, and Cu grows along the whisker structure. The whisker and Cu form a good combination, and there is no pore in the cross-section of the coating. The observation at the cross-section also reveals some characteristics of the toughening mechanism of SiCw, including crack deflection, bridging and whisker pull-out. The existence of these mechanisms indicates that SiCw plays a toughening role in the composites. A suitable plating solution system was selected for the preparation of high-performance Cu/SiCw thermal management materials with the composite electrodeposition process.
最长约 10秒,即可获得该文献文件

科研通智能强力驱动
Strongly Powered by AbleSci AI
更新
大幅提高文件上传限制,最高150M (2024-4-1)

科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
wanci应助自由的傲儿采纳,获得10
1秒前
思明发布了新的文献求助10
2秒前
禹平露发布了新的文献求助10
2秒前
2秒前
酷波er应助tkdzjr12345采纳,获得10
3秒前
逝水发布了新的文献求助10
5秒前
Herzliya发布了新的文献求助80
7秒前
8秒前
9秒前
10秒前
无限大树完成签到,获得积分20
10秒前
Felix完成签到,获得积分10
10秒前
乐乐应助lh采纳,获得10
11秒前
万能图书馆应助奋斗的桐采纳,获得10
11秒前
年华发布了新的文献求助10
12秒前
12秒前
可燃冰完成签到,获得积分10
12秒前
期刊完成签到 ,获得积分10
12秒前
明日香写论文完成签到,获得积分20
12秒前
打打应助Thi采纳,获得10
13秒前
15秒前
谭你脑瓜崩完成签到,获得积分10
16秒前
云朵发布了新的文献求助10
16秒前
呆萌的u完成签到,获得积分10
18秒前
李昕123发布了新的文献求助10
18秒前
iNk应助光亮之桃采纳,获得10
19秒前
禹平露完成签到,获得积分10
21秒前
iNk应助Kristin采纳,获得10
21秒前
iWatchTheMoon应助PAIDAXXXX采纳,获得10
22秒前
称心鸵鸟完成签到,获得积分10
22秒前
24秒前
24秒前
Felix发布了新的文献求助10
24秒前
zhikaiyici完成签到,获得积分10
25秒前
26秒前
羅卜貳发布了新的文献求助10
26秒前
kardeem完成签到,获得积分10
27秒前
求助完成签到 ,获得积分10
27秒前
wanci应助自由的傲儿采纳,获得10
28秒前
28秒前
高分求助中
Evolution 10000
ISSN 2159-8274 EISSN 2159-8290 1000
Becoming: An Introduction to Jung's Concept of Individuation 600
Ore genesis in the Zambian Copperbelt with particular reference to the northern sector of the Chambishi basin 500
A new species of Coccus (Homoptera: Coccoidea) from Malawi 500
A new species of Velataspis (Hemiptera Coccoidea Diaspididae) from tea in Assam 500
PraxisRatgeber: Mantiden: Faszinierende Lauerjäger 500
热门求助领域 (近24小时)
化学 医学 生物 材料科学 工程类 有机化学 生物化学 物理 内科学 纳米技术 计算机科学 化学工程 复合材料 基因 遗传学 催化作用 物理化学 免疫学 量子力学 细胞生物学
热门帖子
关注 科研通微信公众号,转发送积分 3163383
求助须知:如何正确求助?哪些是违规求助? 2814219
关于积分的说明 7903906
捐赠科研通 2473789
什么是DOI,文献DOI怎么找? 1317077
科研通“疑难数据库(出版商)”最低求助积分说明 631615
版权声明 602187