生产线后端
薄脆饼
材料科学
接触电阻
偏移量(计算机科学)
晶片键合
电阻和电导
电子工程
计算机科学
复合材料
光电子学
工程类
图层(电子)
程序设计语言
作者
Kevin Ryan,Nathan Ip,Christopher Netzband,Kun-Chieh Chien,Andrew Tuchman,Jason L. Huang,Scott LeFevre,Ilseok Son,Hiroki Aizawa,Kaoru Maekawa
标识
DOI:10.1109/ectc51529.2024.00216
摘要
A 0.5μm pitch multi-level back-end-of-line (BEOL) test vehicle was developed to evaluate the performance of the wafer-to-wafer (W2W) bonding tool platform. Test structures with intentional pattern misalignment were included to quantify the systematic relationship between the measured electrical resistance and bonding process misalignment. This programmed shift is offset with the local alignment measurements and creates a continuous range of bonding pad contact areas with corresponding variation in the resistance values. This data set can be fit with an analytical model to separate the overall circuit resistance from the contact resistance sensitivity at the bond pad Cu interface.
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