材料科学
兴奋剂
热电效应
接触电阻
金属
热电材料
电阻率和电导率
锑
纳米技术
凝聚态物理
工程物理
冶金
光电子学
复合材料
热导率
电气工程
热力学
物理
工程类
图层(电子)
作者
Man Zhou,Wei Zhu,Shucheng Bao,Jie Zhou,Yuedong Yu,Qingqing Zhang,Chaojie Ren,Zhi Li,Yuan Deng
标识
DOI:10.1021/acsami.4c06713
摘要
Micro thermoelectric devices are expected to further improve the cooling density for the temperature control of electronic devices; nevertheless, the high contact resistivity between metals and semiconductors critically limits their applications, especially in chip cooling with extremely high heat flux. Herein, based on the calculated results, a low specific contact resistivity of ∼10
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