薄膜
材料科学
化学气相沉积
兴奋剂
分析化学(期刊)
氧气
沉积(地质)
体积流量
电阻率和电导率
碳膜
扫描电子显微镜
纳米技术
化学工程
化学
复合材料
光电子学
有机化学
电气工程
古生物学
物理
工程类
量子力学
沉积物
生物
作者
Nur Amalina Muhamad,Firdaus Che Mat,M. Rusop
出处
期刊:Advanced Materials Research
日期:2013-11-01
卷期号:832: 444-448
标识
DOI:10.4028/www.scientific.net/amr.832.444
摘要
The effect of oxygen doping to the properties of CuI thin films was studied. The doping of oxygen to the CuI thin films was done by using single furnace chemical vapor deposition (CVD) method at different oxygen gas flow rate (e.g 10, 20, 30, 40 and 50 sccm). The CuI thin film was first deposited by using mister atomizer at constant CuI solution concentration of 0.05M. The surface morphology and electrical properties of O-doped CuI was studied. The field emission scanning electron microscopy (FESEM) was used to observe the morphology of O-doped CuI thin films. The FESEM images revealed that all the CuI thin films deposited were uniform with the existence of nanostructured CuI particle. The EDX measurement confirm the existence of Cu:I in the films and also the variation of oxygen ratio in the CuI thin films as the oxygen was introduced. The resistivity of 10 1 Ωcm to 10 3 Ωcm at constant voltage of-5V to 5V was obtained for the O-doped CuI thin films.
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