Binder-free bonding of modularized MXene thin films into thick film electrodes for on-chip micro-supercapacitors with enhanced areal performance metrics

An efficient and easily-manipulated protocol was developed to prepare binder/conductive-additives free thick MXene film electrodes through bonding the modularized thin films only with water. The thickness can be multiplied by increasing the number of superposed modularized thin MXene films.