聚醚酰亚胺
电容器
材料科学
电介质
聚酰亚胺
聚合物电容器
薄膜电容器
聚合物
复合材料
数码产品
工程物理
电气工程
光电子学
纳米技术
电解电容器
图层(电子)
电压
工程类
作者
Qi Tan,Lili Zhang,Qin Chen,Patricia Irwin
标识
DOI:10.1007/s11664-014-3440-7
摘要
Film capacitor technology has been under development for over half a century to meet various applications such as direct-current link capacitors for transportation, converters/inverters for power electronics, controls for deep well drilling of oil and gas, direct energy weapons for military use, and high-frequency coupling circuitry. The biaxially oriented polypropylene film capacitor remains the state-of-the-art technology; however, it is not able to meet increasing demand for high-temperature (>125°C) applications. A number of dielectric materials capable of operating at high temperatures (>140°C) have attracted investigation, and their modifications are being pursued to achieve higher volumetric efficiency as well. This paper highlights the status of polymer dielectric film development and its feasibility for capacitor applications. High-temperature polymers such as polyetherimide (PEI), polyimide, and polyetheretherketone were the focus of our studies. PEI film was found to be the preferred choice for high-temperature film capacitor development due to its thermal stability, dielectric properties, and scalability.
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