微电子
薄脆饼
绝缘体上的硅
硅
光伏
纳米技术
工程物理
技术路线图
混合硅激光器
材料科学
工程类
电气工程
光伏系统
光电子学
业务
营销
作者
Graham R. Fisher,M. Seacrist,Robert Standley
出处
期刊:Proceedings of the IEEE
[Institute of Electrical and Electronics Engineers]
日期:2012-04-04
卷期号:100 (Special Centennial Issue): 1454-1474
被引量:103
标识
DOI:10.1109/jproc.2012.2189786
摘要
Silicon substrates form the foundation of modern microelectronics. Whereas the first 50 years of silicon wafer technology were primarily driven by the microelectronics industry, applications in photovoltaics (PV) also promise to drive new advances in silicon wafer technology over the next ten years. In the first part, we review the historical development of semiconductor silicon wafer technology and highlight recent technical advances in bulk crystal growth and wafering technologies, including the development of silicon-on-insulator (SOI) technologies and ultrathin wafers. We then discuss technologies that could take us beyond the current capabilities of complementary metal-oxide-semiconductor (CMOS) devices. In the second part, we review silicon manufacturing for PV applications and some unique wafering technology challenges in that field. Finally, we summarize industry roadmaps and product needs highlighting key technical areas which promise to shape the future of silicon wafer technologies in the coming decades.
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