分子动力学
抛光
材料科学
化学机械平面化
旋转(数学)
复合材料
动力学(音乐)
机械工程
化学
工程类
物理
计算化学
几何学
数学
声学
作者
Ruling Chen,Pengju Zhou,Hui Li
标识
DOI:10.1016/j.triboint.2024.109716
摘要
A three-body wear model, comprising a soft polyurethane pad, silica abrasive, and crystalline silicon substrate, was established to analyze the impact of abrasive rotation on material removal process during chemical mechanical polishing (CMP) through molecular dynamics simulation. The results revealed that abrasive rotation, facilitated by the cooling effect, would reduce the local temperature in the contact area between the abrasive and the substrate, thereby enhancing the surface quality of the substrate and decreasing the material removal volume (MRV). However, another effect of abrasive rotation, termed the "hedgehog effect", resulting in an increase in MRV. Through the trade-off between the cooling effect and the porcupine effect, the abrasive rotation can not only improve surface quality but also increase the MRV.
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