Preparation,structure and performance of silver-plating copper filled epoxy conductive adhesive

In this paper,using bisphenol A epoxy resin as the matrix,TEPA as the curing agent,silver-plating copper powder as the conductive filler and AA-75 as the dispersant,the silver-plating copper filled epoxy conductive adhesive was prepared.DC low-resistance tester is used to measure the volume resistivity,infra-red spectrometry is used to characterize the adhesives with different amount of curing agent and differential scanning calorimetry is used to determine the optimal curing reaction temperature.The result showed that under the optimal proportions and process conditions the volume resistivity of conductive adhesive is 8.9×10-4 Ω·cm.