CMOS芯片
带隙基准
寄生提取
带隙
电子工程
材料科学
宽禁带半导体
电气工程
逻辑门
数码产品
半导体
光电子学
电压
工程类
电压源
跌落电压
作者
Samuel James Bader,Hyunjea Lee,Reet Chaudhuri,Shi-Min Huang,Austin Hickman,Alyosha Molnar,Huili Grace Xing,Debdeep Jena,Han Wui Then,Nadim Chowdhury,Tomás Palacios
标识
DOI:10.1109/ted.2020.3010471
摘要
Power and RF electronics applications have spurred massive investment into a range of wide and ultrawide bandgap semiconductor devices which can switch large currents and voltages rapidly with low losses. However, the end systems using these devices are often limited by the parasitics of integrating and driving these chips from the silicon complementary metal-oxide-semiconductor-based design (CMOS) circuitry necessary for complex control logic. For that reason, implementation of CMOS logic directly in the wide bandgap platform has become a way for each maturing material to compete. This review examines potential CMOS monolithic and hybrid approaches in a variety of wide bandgap materials.
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