伤口愈合
壳聚糖
材料科学
免疫系统
生物物理学
自愈水凝胶
生物医学工程
刺激
化学
纳米技术
免疫学
医学
高分子化学
生物化学
生物
内科学
作者
Mujie Liu,Yuheng Wang,Haodong Wang,Lihong Qi,Yu‐Xuan Shang,Jiajie Song,Xiu-Long Feng,Yiwei Chen,Waqar Ali Memon,Yuping Shen,Xiaodong Wu,Jiangbei Cao,Yifan Zhao,Zhuangde Jiang,Dingxin Liu,Shareen Shafique,Shengtao Li,Guanghao Lu,Zhixiang Wei,Zhi‐Jie Liu
出处
期刊:Advanced Science
[Wiley]
日期:2025-02-14
卷期号:12 (13): e2411889-e2411889
被引量:12
标识
DOI:10.1002/advs.202411889
摘要
In this study, an electret-inspired, charge-injected hydrogel called QOSP hydrogel (QCS/OD/SDI/PANI/PS/Plasma) that promotes scar-free healing of bacteria-infected burns through bioelectrical stimulation and immune modulation, is presented. The hydrogel, composed of quaternized chitosan (QCS), oxidized dextran (OD), sulfadiazine (SDI), polystyrene (PS), and polyaniline nanowires (PANI), forms a conductive network capable of storing and releasing electric charges, emulating an electret-like mechanism. This structure delivers bioelectrical signals continuously, enhancing wound healing by regulating immune responses and minimizing fibrosis. In a mouse model of second-degree burns infected with Staphylococcus aureus (SA) and Pseudomonas aeruginosa (PA), the hydrogel accelerates wound healing by 32% and reduces bacterial load by 60%, significantly inhibited scar formation by 40% compared to controls. QOSP hydrogel modulates the Th1/Th2 immune balance toward a Th1-dominant antifibrotic state through quaternized chitosan, thereby reducing collagen deposition by 35%. Electro-dielectric characterization reveals a dielectric constant of 6.2, a 34% improvement in conductivity (3.33 × 10-5 S/m) and a 30 °C increase in thermal stability. Proteomic analysis highlights a 50% down-regulation of pro-inflammatory and pro-fibrotic pathways, suggesting a controlled immune response conducive to scar-free healing. This study underscores the potential of bioelectrically active hydrogels as a novel approach for treating infected wounds prone to scarring.
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