伤口愈合
壳聚糖
材料科学
免疫系统
生物物理学
自愈水凝胶
生物医学工程
刺激
化学
纳米技术
免疫学
医学
高分子化学
生物化学
生物
内科学
作者
Mujie Liu,Yuheng Wang,Haodong Wang,Lihong Qi,Yu‐Xuan Shang,Jiajie Song,Xiu-Long Feng,Yiwei Chen,Waqar Ali Memon,Yuping Shen,Xiaodong Wu,Jiangbei Cao,Yifan Zhao,Zhuangde Jiang,Dingxin Liu,Shareen Shafique,Shengtao Li,Guanghao Lu,Zhixiang Wei,Zhi‐Jie Liu
标识
DOI:10.1002/advs.202411889
摘要
Abstract In this study, an electret‐inspired, charge‐injected hydrogel called QOSP hydrogel (QCS/OD/SDI/PANI/PS/Plasma) that promotes scar‐free healing of bacteria‐infected burns through bioelectrical stimulation and immune modulation, is presented. The hydrogel, composed of quaternized chitosan (QCS), oxidized dextran (OD), sulfadiazine (SDI), polystyrene (PS), and polyaniline nanowires (PANI), forms a conductive network capable of storing and releasing electric charges, emulating an electret‐like mechanism. This structure delivers bioelectrical signals continuously, enhancing wound healing by regulating immune responses and minimizing fibrosis. In a mouse model of second‐degree burns infected with Staphylococcus aureus (SA) and Pseudomonas aeruginosa (PA), the hydrogel accelerates wound healing by 32% and reduces bacterial load by 60%, significantly inhibited scar formation by 40% compared to controls. QOSP hydrogel modulates the Th1/Th2 immune balance toward a Th1‐dominant antifibrotic state through quaternized chitosan, thereby reducing collagen deposition by 35%. Electro‐dielectric characterization reveals a dielectric constant of 6.2, a 34% improvement in conductivity (3.33 × 10 −5 S/m) and a 30 °C increase in thermal stability. Proteomic analysis highlights a 50% down‐regulation of pro‐inflammatory and pro‐fibrotic pathways, suggesting a controlled immune response conducive to scar‐free healing. This study underscores the potential of bioelectrically active hydrogels as a novel approach for treating infected wounds prone to scarring.
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