Rapid electric field-enhanced crystallization of amorphous silicon thin films with an aluminum layer

A rapid aluminum induced crystallization (AIC) method of amorphous silicon (a-Si) thin film was suggested. A constant electrical current is supplied to an aluminum (Al) layer deposited on the a-Si thin film and anneals the Al/Si stack fast by Joule-heating. The Joule heating is presumed to expedite a-Si thin film crystallization. To investigate the crystallization mechanism, an in-situ temperature and reflectivity measurement was adopted during the process. The maximum crystallization temperature was 744.15 K, which was found to be similar to the typical furnace AIC process temperature and less than the Al/Si eutectic temperature of 850 K. The measured and calculated surface reflectivity demonstrated the rapid Al induced layer exchange behavior between Si and Al layers. The entire process was accomplished for only a few dozens of seconds. This rapid layer exchange is caused by sudden increase of temperature-dependent Al diffusion coefficient in a Si layer and additional electric field enhancement. The Raman peak of 519 cm−1 verified the formation of polycrystalline silicon (p-Si) after the Al etching process. Scanning electron microscopy images showed that the resulting p-Si structure was porous with an average pore size of around 1.2 μm.