封装(网络)
光伏系统
可靠性(半导体)
可靠性工程
材料科学
汽车工程
计算机科学
工程类
电气工程
计算机网络
功率(物理)
物理
量子力学
作者
Bin Luo,Jonathan Govaerts,Fabiana Lisco,Gabriele Eder,Bram Breukers,Bart Ruttens,Jan D’Haen,Rik Van Dyck,Hariharsudan Sivaramakrishnan Radhakrishnan,Aart Willem Van Vuure,Jef Poortmans
标识
DOI:10.1016/j.solmat.2024.112932
摘要
Lightweight modules are essential for next-generation vehicle-integrated photovoltaic (VIPV) applications, such as solar-powered cars, allowing integration of solar cells beyond the roof, and on the hood, boot and body panels, and thereby extending the driving range. However, the lightweight module's reliability and corresponding degradation mechanisms under various environmental stresses are less researched. In this work, we investigate interconnection and encapsulation strategies to improve reliability against damp heat and mechanical impact. We fabricated lightweight mini modules, weighing around 3.45 kg/m2, and conducted hail impact and damp heat tests. These tests result in different failures, such as cracks in the solar cell, module delamination, and microcracks in the backsheet. By carrying out failure mechanism analysis and altering the fiber reinforcement in backsheet and encapsulation materials, we can increase resilience to these failure modes, thus providing guidance for the design of lightweight PV modules for next-generation VIPV.
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