Self‐Bonded Wood Composites with Efficient Heat Dissipation Enabled by In‐Situ Grown Co/Zn Bimetallic MOFs

Abstract Most electronic product packaging materials are made of plastic, a petroleum‐based material with limited heat dissipation capabilities, restricting its suitability for heat‐intensive electronic products. Wood‐based composites have gained widespread usage due to their environmental friendliness and cost‐effectiveness. However, the low thermal conductivity restricts their application in electronic product packaging requiring efficient heat dissipation. Here, a high‐strength wood‐based composite with excellent thermal conductivity and antibacterial property (WBC/ZIF‐67/8) is constructed through self‐bonding technology. The WBC/ZIF‐67/8 composite demonstrates exceptional mechanical properties with tensile and flexural strengths of 66.87 and 86.33 MPa, respectively. Importantly, it exhibits efficient thermal conductivity of 1.01 W mK −1 , significantly surpassing that of densified wood. This superior performance is attributed to the core‐shell structure formed through the in situ growth of ZIF‐67/8 crystals on wood fibers. Although wood fibers themselves exhibit relatively low thermal conductivity, this structure enables effective conduction and diffusion of heat at the interface between ZIF‐67/8 crystals with high thermal conductivity and wood fibers. Simultaneously, the introduction of ZIF‐67/8 crystals enhanced antibacterial and anti‐mildew properties of composite. These improvements in thermal conductivity and heat dissipation capability pave the way for the application of wood‐based composites in durable and sustainable electronic product packaging.