Dual-cluster interpretation of Au–Sn binary eutectics and solders

共晶体系 对偶(语法数字) 口译(哲学) 材料科学 星团(航天器) 二进制数 冶金 计算机科学 微观结构 数学 哲学 语言学 算术 程序设计语言
作者
Yupeng Ma,Fei Wang,Z.M. Li,Huan Liu,Ran Tang,Huicong Yin,Junxi Zhang,Sihan Yang,Dandan Dong
出处
期刊:AIP Advances [American Institute of Physics]
卷期号:14 (3) 被引量:1
标识
DOI:10.1063/5.0192364
摘要

Au–Sn alloy is an important high-temperature solder, but it has some disadvantages such as high cost and brittleness. Multicomponent alloying is often performed to improve performance and reduce their cost. However, due to the absence of an atomic structure model, there has been a lack of effective theory to guide their composition design. Since Au–Sn solders are typically eutectic-based, understanding the Au–Sn eutectic at the atomic level is of great significance for clarifying the composition origin of Au–Sn solders and the subsequent multi-component composition design. In the present work, the short-range order of Au–Sn eutectics is characterized using a dual-cluster model. In the dual-cluster formulism, the two eutectics Au69.6Sn30.3 and Sn94.6Au5.4 at. % are interpreted in terms of the hypoeutectic [SnAu12]Sn2Au3 + [Au–Au2Sn6]Au3 = Au70.0Sn30.0 and [Au–Sn8]Au1 + 2{[Sn–Sn10]Sn5} = Sn95.2Au4.8 alloys, respectively. The compositions of Au–Sn solders are then analyzed based on the interpreted dual-cluster formulas, which indicate that the number of atoms of the alloying elements that replace the atoms in the dual-cluster formulas is always an integer. The present method provides a quantitative approach toward developing a practical composition interpretation and design tool for Au–Sn-based solders.

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