Boron nitride microribbons (BNMRs) strengthened and toughened alumina composite ceramics with excellent mechanical, dielectric, and thermal conductivity properties

氮化硼 材料科学 复合材料 陶瓷复合材料 复合数 电介质 结构材料 陶瓷 热导率 氮化物 化学 光电子学 有机化学 图层(电子)
作者
Jilin Wang,Dongping Lu,Weiping Xuan,Yuchun Ji,Ruiqi Chen,Shaofei Li,Wenbiao Li,Wenzhuo Chen,Shilin Tang,Guoyuan Zheng,Fei Long
出处
期刊:Journal of Advanced Ceramics [Springer Nature]
卷期号:13 (4): 496-506 被引量:3
标识
DOI:10.26599/jac.2024.9220872
摘要

Aluminum oxide (Al2O3) ceramics have been widely utilized as circuit substrates owing to their exceptional performance. In this study, boron nitride microribbon (BNMR)/Al2O3 composite ceramics are prepared using spark plasma sintering (SPS). This study examines the effect of varying the amount of toughened phase BNMR on the density, mechanical properties, dielectric constant, and thermal conductivity of BNMR/Al2O3 composite ceramics, while also exploring the mechanisms behind the toughening and increased thermal conductivity of the fabricated ceramics. The results showed that for a BNMR content of 5 wt%, BNMR/Al2O3 composite ceramics displayed more enhanced characteristics than pure Al2O3 ceramic. In particular, the relative density, hardness, fracture toughness, and bending strength were 99.95±0.025%, 34.11±1.5 GPa, 5.42±0.21 MPa·m1/2, and 375±2.5 MPa, respectively. These values represent increases of 0.76%, 70%, 35%, and 25%, respectively compared to those of pure Al2O3 ceramic. Furthermore, during the SPS process, BNMRs are subjected to high temperatures and pressures, resulting in the bending and deformation of the Al2O3 matrix; this leads to the formation of special thermal pathways within it. The dielectric constant of the composite ceramic decreased by 25.6%, whereas the thermal conductivity increased by 45.6% compared with that of the pure Al2O3 ceramic. The results of this study provide valuable insights into ways of enhancing the performance of Al2O3-based ceramic substrates by incorporating novel BNMRs as a second phase. These improvements are significant for potential applications in circuit substrates and related fields that require high-performance materials with improved mechanical properties and thermal conductivities.

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