研磨
磨料
机械加工
材料科学
脆性
复合材料
陶瓷基复合材料
GSM演进的增强数据速率
陶瓷
冶金
计算机科学
电信
作者
Yichuan Ran,Jiansong Sun,Renke Kang,Zhigang Dong,Yan Bao
标识
DOI:10.1016/j.compositesb.2024.111657
摘要
The challenge of machining ceramic matrix composites (CMCs) arises from their hard and brittle, anisotropic, and heterogeneous nature, making them prone to damage such as edge chipping, fiber fracture, and interfacial debonding during grinding. To gain a thorough understanding of CMCs' grinding performance, this paper discusses in detail the removal behavior under the action of abrasive grain, focusing on the micro-interaction of abrasive grain and material. Following this analysis, various strategies for modeling grinding forces are elaborated. Then, we outline the quality evaluation of CMCs and offer solutions to mitigate grinding damage by comprehensively assessing the factors affecting material removal in CMCs. Ultimately, the prospects and potential advancements in the application of grinding processes for CMCs are highlighted.
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