The Study on Warpage of Epoxy Molding Compound

There are many factors have effects on the warpage control of epoxy molding compound (EMC). Some key factors such as epoxy resin, filler content and stress reliever were selected to design different formulations of EMC to study the effect on warpage. Epoxy resin A with the stucture in Fig. 1a and epoxy resin B with the stucture in Fig. 1b were used to the formula. Varying the weight ratio of epoxy resin A/epoxy resin B resulted in products with different warping, ranging from short-edged smiling to long-edged crying. The same transformation were also observed with the filler content increased. In addition, stress reliever are used to sovle the problem of warpage varies greatly for different thickness of epoxy molding compound.