清晨好,您是今天最早来到科研通的研友!由于当前在线用户较少,发布求助请尽量完整的填写文献信息,科研通机器人24小时在线,伴您科研之路漫漫前行!

Nanoscale tribological aspects of chemical mechanical polishing: A review

化学机械平面化 薄脆饼 材料科学 抛光 半导体器件制造 钻石 纳米技术 冶金
作者
Debottam Datta,Himanshu Rai,Swarnima Singh,Meenakshi Srivastava,Rajesh Sharma,Nitya Nand Gosvami
出处
期刊:Applied surface science advances [Elsevier]
卷期号:11: 100286-100286 被引量:3
标识
DOI:10.1016/j.apsadv.2022.100286
摘要

The semiconductor industry is the backbone of exponentially growing digitization. Countries from the east and the west both are investing significantly to accelerate this growth. Chemical mechanical planarization (CMP) is one of the crucial technologies for expediting this growth. In 1986, IBM first developed CMP for the polishing of oxide layers. In 1988, it was deployed for the polishing of tungsten. Very soon, the CMP process became popular among the academic researchers and industries due to its global as well as local surface planarization capacity. As the number of active components in a wafer is increasing significantly, the feature size is decreasing for developing high performance integrated circuit (IC) chips. Along with the reducing feature sizes, multiple levels are being implemented. These additional levels necessitate multilevel interconnection. To accommodate all these features, CMP has become an inevitable process for both the semiconductor and solar cell wafer manufacturing industries. The CMP provides a critical support for achieving good surface finish at various levels of IC fabrication. Furthermore, the CMP is also used for the surface polishing of a wide range of materials including sapphire wafers, titanium based biomedical implants, aluminium, copper, YAG crystals, zirconium ceramics, cobalt, molybdenum etc. After its development, ample studies have been carried out for further improvement of CMP processes. However, the intricacy of the process parameters for different wafer & pad materials and slurry composition makes it difficult to indiscriminately apply to any wafer or alloys. Most of the studies have been discretely carried out either on a specific wafer material or based on controlled investigations of certain parameters. In this review paper, CMP has been analysed holistically based on its nanoscale tribological aspects. Several studies have been discussed for the relevant parameters at nano and microscale level including morphology, type, and size of abrasive particles, as well as the arrangement of polishing pad asperities and their conditioning to explore the nanotribological characteristics of CMP. Subsequently, atomic force microscopy (AFM) based studies on CMP have been discussed to correlate it with macroscale CMP. As our mother nature is facing environmental crisis world-wide, research communities should develop environment friendly processes for production. In this regard, the scientists are developing environment friendly CMP process to mitigate the burden of environment. At the same time, researchers can save a mammoth quantity of laboratory resources by carrying out the nanoscale studies of CMP using molecular dynamics simulation approach. In this review, both the green CMP and molecular dynamics studies related to CMP have been discussed. Moreover, the readers can grasp the challenges, difficulties, and achievements of CMP from the nanotribological point of view. Finally, the review presents some insights that can be implemented for further improvements of CMP process.
最长约 10秒,即可获得该文献文件

科研通智能强力驱动
Strongly Powered by AbleSci AI
更新
大幅提高文件上传限制,最高150M (2024-4-1)

科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
牧沛凝完成签到 ,获得积分10
7秒前
遥感小虫发布了新的文献求助10
12秒前
Lamis完成签到 ,获得积分10
23秒前
青春梦完成签到 ,获得积分10
40秒前
Leo完成签到 ,获得积分10
1分钟前
YumiPg完成签到,获得积分10
1分钟前
黙宇循光完成签到 ,获得积分10
1分钟前
相南相北完成签到 ,获得积分10
2分钟前
凶狠的盛男完成签到 ,获得积分10
2分钟前
yuehan完成签到 ,获得积分10
2分钟前
梓歆完成签到 ,获得积分10
2分钟前
闪闪的谷梦完成签到 ,获得积分10
2分钟前
这个文献你有么完成签到,获得积分10
2分钟前
vitamin完成签到 ,获得积分10
2分钟前
研友_nEWRJ8完成签到,获得积分10
3分钟前
田様应助科研通管家采纳,获得10
3分钟前
刘玲完成签到 ,获得积分10
4分钟前
jingjili完成签到,获得积分0
5分钟前
5分钟前
jingjili发布了新的文献求助10
5分钟前
拓跋雨梅完成签到 ,获得积分0
5分钟前
郭星星完成签到,获得积分10
5分钟前
个性仙人掌完成签到 ,获得积分10
5分钟前
Echoheart完成签到,获得积分10
6分钟前
咯咯咯完成签到 ,获得积分10
6分钟前
淡淡醉波wuliao完成签到 ,获得积分10
7分钟前
even完成签到 ,获得积分10
7分钟前
研友_Z119gZ完成签到 ,获得积分10
7分钟前
沙海沉戈完成签到,获得积分0
7分钟前
Shandongdaxiu完成签到 ,获得积分10
7分钟前
如意的馒头完成签到 ,获得积分10
7分钟前
kenchilie完成签到 ,获得积分10
7分钟前
Summer_Xia完成签到 ,获得积分10
10分钟前
11分钟前
小郭发布了新的文献求助20
12分钟前
不安青牛应助偷西瓜的猹采纳,获得10
12分钟前
12分钟前
小郭发布了新的文献求助10
12分钟前
吉吉完成签到 ,获得积分10
12分钟前
12分钟前
高分求助中
Evolution 10000
ISSN 2159-8274 EISSN 2159-8290 1000
Becoming: An Introduction to Jung's Concept of Individuation 600
Ore genesis in the Zambian Copperbelt with particular reference to the northern sector of the Chambishi basin 500
A new species of Coccus (Homoptera: Coccoidea) from Malawi 500
A new species of Velataspis (Hemiptera Coccoidea Diaspididae) from tea in Assam 500
PraxisRatgeber: Mantiden: Faszinierende Lauerjäger 500
热门求助领域 (近24小时)
化学 医学 生物 材料科学 工程类 有机化学 生物化学 物理 内科学 纳米技术 计算机科学 化学工程 复合材料 基因 遗传学 催化作用 物理化学 免疫学 量子力学 细胞生物学
热门帖子
关注 科研通微信公众号,转发送积分 3162343
求助须知:如何正确求助?哪些是违规求助? 2813330
关于积分的说明 7899736
捐赠科研通 2472848
什么是DOI,文献DOI怎么找? 1316533
科研通“疑难数据库(出版商)”最低求助积分说明 631375
版权声明 602142