Design. Fabrication, and Test of an Embedded Si-Glass Microchannel Heat Sink for High-power RF Application

散热片 材料科学 微通道 热导率 散热膏 计算机冷却 热阻 薄脆饼 制作 机械工程 热撒布器 传热 复合材料 光电子学 机械 工程类 电子设备和系统的热管理 纳米技术 病理 物理 医学 替代医学
作者
Jianyu Du,Weihao Li,Xu Gao,Deyin Zheng,Yu‐Chi Yang,Zetian Wang,Haoran Zhao,Jiajie Kang,Wei Wang
标识
DOI:10.1109/icept52650.2021.9568212
摘要

The heat dissipation of power amplifier (PA) chips is one of the biggest challenges in the development of miniaturized state of art glass-based high-power RF modules. Glass has excellent electrical properties, but the extremely poor thermal conductivity of it also brings many barriers in the application. Its (quartz glass) thermal conductivity is only 1/93 of that of silicon, so there will be a problem of poor heat dissipation. In recent years, there has been an increasing amount of literature on microfluidic cooling technology and this method was demonstrate as an efficient way in cooling application. In this article, we designed, fabricated, and tested a Si-Glass microchannel heat sink, which took advantage of the high thermal conductivity of silicon to deal with the insufficient thermal conductivity of the glass interposer. Finite element simulation was used to study the thermal property of the Si-Glass heat sink and a multi-parameter optimal method was used to design the geometrical parameters, including the number of flow channels and other geometrical parameters of the heat sink. Then the aforementioned microchannel heat sinks were fabricated using cleanroom fabrication on 4-inch silicon and glass wafers. To complete the thermal test, the Thermal Demonstration Vehicles (TDVs) were fabricated by bonding the sample onto a customized PDMS holder for fluid connections with the flow loop. A programmable power source was used to heat the TDV in a stepwise manner, and a syringe pump was used to supply the liquid to cool the heat sink. Results show that the heat sink can dissipate heat flux greater than 150W/cm 2 with substrate temperature lower than 100°C.
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