Comparative Analysis of Temperature-induced Micro-scale Deformation of Package by Experiment and Finite Element Analysis

Finite element analysis (FEA) is expected to play an important role in the evaluation of electronic packaging reliability. However, the rationality of the detailed parameter of material properties and boundary conditions in simulation requires sufficient verification to guarantee the accuracy. Insitu micro-scale experimental characterization could effectively check the simulation results and help to deepen the understanding of the root cause of the failure. In this paper, we investigated the microscopic deformation of the cross section of one flip-chip package during heating process by using the in-situ two-dimensional digital image correlation (2D-DIC) combined with FEA. After a series of verification, the FEA results showed highly consistency with the 2D-DIC experiments. The anisotropy parameters of the substrate, which seldom attracts attention, was demonstrated to have significant effect on the deformation. Our work may help to improve the application of in-situ DIC and FEA in the stress analysis of package structures.