Fabrication of Cu-GO layered composites with enhanced thermal conductivity by ultrasonic spraying and electrodeposition

The Cu-GO layered composites with excellent thermal conductivity were fabricated by ultrasonic-assisted electrodeposition and ultrasonic spraying composite processes. Moreover, the impact of the spraying frequency and spraying path of GO solution on the surface morphology, microstructure and thermal conductivity of the composites were investigated. The experimental findings indicated that the formation of the Cu–O–C covalent bonding and the interfacial product Cu2O among the Cu layers and the GO film enhanced the Cu/C interfacial bonding during the ultrasonic-assisted electrodeposition. The in-plane thermal conductivity of the composites reached 548.06 W m−1·-k−1 at the optimum process parameters, which was 76.2% higher compared to the pure Cu foil. In this work, the enhancement of the Cu/C interfacial bonding and the optimization of the microstructure of GO and Cu in the composites were responsible for the substantial enhancement of the thermal properties of the Cu-GO layered composites.