Study of submicron-resolution, high-accuracy overlay and large-field lithography for advanced packaging

Demand for advanced graphics processing unit, field programmable gate array, and artificial intelligence (AI) chips continues to grow as many systems require more computing power for applications, such as AI processing and deep learning. To produce higher-performance chips, 2.5D silicon interposer technology has been developed and matured as a solution enabling high-speed data transmission between different chips, such as processors and dynamic random access memory. Increased I/O counts are required to enable higher bandwidth communication between semiconductor chips and silicon interposers can help realize higher-performance devices. Microbumps used to interconnect chips and interposers and redistribution layer must be scaled down to achieve high-density connections and next-generation devices also require larger interposers to support heterogeneous integration of multiple dies. We highlight the performance of the FPA-5520iV LF2-option stepper that is designed to provide the optimal stepper performance required for the next generation 2.5D interposers, including submicron resolution, high-accuracy mix-and-match overlay, and large field exposure.