Correlating the Molecular Structure of Polyimides with the Dielectric Constant and Dissipation Factor at a High Frequency of 10 GHz

电介质 极化率 偶极子 耗散因子 材料科学 介电常数 物理化学 计算化学 化学 热力学 有机化学 分子 物理 光电子学
作者
Chih‐Cheng Kuo,Yan‐Cheng Lin,Yu-Che Chen,Ping‐Han Wu,Shinji Ando,Mitsuru Ueda,Wen‐Chang Chen
出处
期刊:ACS applied polymer materials [American Chemical Society]
卷期号:3 (1): 362-371 被引量:89
标识
DOI:10.1021/acsapm.0c01141
摘要

The relationships between the structure and the dielectric properties of polyimides (PIs) were extensively studied to construct universal correlations of dielectric constant (Dk) and dissipation factor (Df) on the structural parameters. In this study, 36 kinds of PIs with a plethora of functional groups including ether, fluorine, amide, ester, ketone, sulfide, sulfone, and alkane groups were prepared by polyaddition and thermal imidization. Accordingly, their thermal, mechanical, and dielectric properties were systematically investigated. The experimental results showed highly correlated relationships between the Dk values and two structural parameters of fluorine content (F%) and volume polarizability (P/V) with a correlation coefficient of 0.98 and 0.90, respectively. Likewise, the Df value was highly correlated to the imide group content (Imide%) with a correlation coefficient of 0.95. However, a multiple positive trend was found in the relationship between the Df values and the volume dipole moment (μ/V) for the PIs. The discrepancy might be resulted from the difficulty to elucidate local molecular motions in the unit structure of PIs. Nevertheless, the Df values still presented a nontrivial relation to the orientational polarization and dipole moment of the unit structures. Collectively, our experimental results revealed the structure–dielectric properties relationships of the PIs by rational definition on a series of structural parameters and warrant further investigation. Meanwhile, this work provides systematic guidelines for molecular structure design of PIs which are promising for high frequency applications on the fifth-generation (5G) mobile communications technology.
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