Thickness control of a thin film after drying through thermal and evaporative management in drying process of a polymer solution coated on a flat substrate: application of the dynamical model of the drying process

We have proposed and modified a model of drying process of polymer solution coated on a flat substrate for flat polymer film fabrication supposing resist coating process in semiconductor engineering process and so on. And we have clarified dependence of distribution of polymer molecules on a flat substrate on a various parameters based on analysis of many numerical simulations of the model. Then we applied the model to thickness control of a thin film after drying through thermal management. But minute thickness control of a thin film after drying was not enough and more minute thickness control of it was desired. Therefore, in this study, we add evaporative management for more minute thickness control of a thin film after drying. As a result, thickness control of a thin film after drying in drying process of a polymer solution coated on a flat substrate can be improved further through adding evaporative operations to thermal operations artificially and instantaneously depending on solute's distribution during drying.