3D Silicon Photonics Packaging Based on TSV Interposer for High Density On-Board Optics Module

A 3D silicon photonics packaging architecture based on a Cu-metallized Si-photonics through-silicon-via (TSV) interposer has been designed and experimentally demonstrated, which achieves flexible and compact electro-optical integration of different functionalities for high density on-board optics module. 3D photonics architecture for on-package integration overcomes the difficulties in sophisticated co-integration electronic design automation (EDA) tool and processing skills of monolithic integration. This photonic TSV interposer consists of monolithically integrated TSV, tunable arrayed waveguide grating (AWG), optical (Mach-Zehnder Interferometer) modulators and germanium photodetectors (PD). The fabrication process of this 3D photonics architecture is presented. 800 GHz channel tunability is achieved by the tunable AWG, and 20 GHz-bandwidth and 28 GHz-bandwidth is achieved by the silicon modulator and germanium PD on this on-package TSV integration module, respectively. This 3D photonics module realizes a 30 Gbps-data rate. This work has established the toolboxes of 3D silicon photonics packaging based on TSV interposer for high density on-board optics module.