再结晶(地质)
材料科学
退火(玻璃)
合金
体积分数
冶金
动态再结晶
微观结构
粒度
热加工
复合材料
生物
古生物学
作者
Jun Ting Zhang,Jinbao Lin,Qianqian Wang,Xiu Li Du,You hong Wang
标识
DOI:10.1080/02670836.2020.1759275
摘要
The recrystallization behaviour during annealing of cold-rolled Cu–5Fe–2Sn alloy was clarified in this paper. The effects of annealing temperature and time on the microstructure and properties of the Cu–5Fe–2Sn alloy were investigated. The equations of electrical conductivity and recrystallization kinetics during annealing were obtained with Martition's rule and Avrami empirical formula. The variations of recrystallization volume fraction and the growth of recrystallization grain for Cu–5Fe–2Sn alloy after 40% cold rolling were discussed. The calculated conductivity and volume fraction of recrystallization have a good match with experimental results. The variations of the properties of annealed Cu–5Fe–2Sn alloy are attributed to the growth rate of recrystallization phase and the size of recrystallization grains.
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