材料科学
光电子学
接触电阻
辐照
晶体管
分析化学(期刊)
电子束处理
拓扑(电路)
物理
纳米技术
电气工程
化学
电压
核物理学
有机化学
工程类
图层(电子)
作者
P. Antonioli,Alessandro Grillo,Aniello Pelella,Enver Faella,M. Passacantando,Nadia Martucciello,Filippo Giubileo
出处
期刊:International Conference on Nanotechnology
日期:2021-07-28
标识
DOI:10.1109/nano51122.2021.9514329
摘要
We report a systematic electrical characterization of Mos 2 and PdSe 2 based FETs, with Ti/Au and Pd/Au contacts respectively, to investigate the effect of electron beam irradiation on the transistor channel current, threshold voltage, and contact resistance. We use a 10 keV electron beam inside a scanning electron microscope to irradiate the channel and/or the contact regions of the transistors and perform in-situ electrical measurements profiting of high precision metallic nanoprobes working as the source and the drain contacts. For Mos 2 based devices, we investigate the effect of electron irradiation either on the contact region or on the channel regions. Irradiation of the contact region causes an improvement of the transistor conduction by lowering the contact resistance, which we explain in terms of Schottky barrier reduction at the metal/Moxa interfaces. The irradiation with fluence below 100 e − /nm 2 on Mos 2 channel region increases the device conductance and shifts the threshold voltage towards more negative voltages. For PdS2 based devices, electron beam irradiation with larger fluence up to 4200 e − /nm 2 is detrimental to the conduction properties of the device, causing modification of the conduction from n-type to p-type, likely due to the accumulation of negative charges at the Si/SiO 2 interface. Moreover, charge carrier mobility is reduced by the formation of defects both in the PdSe2 nanosheets and at the Si/Si02 interface.
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