倒装芯片
可靠性(半导体)
材料科学
温度循环
结温
模具(集成电路)
热膨胀
炸薯条
有限元法
电子包装
热的
光电子学
电子工程
机械工程
功率(物理)
电气工程
复合材料
结构工程
工程类
纳米技术
胶粘剂
物理
图层(电子)
量子力学
气象学
作者
Xiaoyu Xiao,Yamei Yan,Gui Chen,Wenhui Zhu
标识
DOI:10.1109/icept52650.2021.9568029
摘要
Thermal compression bonding provides a good solution for the packaging of micro-LED chips, greatly increases the resolution of micro-led, and can achieve higher density integration and better display effect. In order to study the thermomechanical reliability and display stability of micro-LED devices under thermal cycling load and working power load, this paper first explains the limitation of thermal expansion coefficient (CTE) mismatch on the size of flip chip devices by mathematical method, and proposes a low temperature indium bump flip chip bonding technology which can overcome this defect. Then, the finite element model is established to study the influence of different metal bump materials on the reliability of micro-LED devices under thermal cycling load, and the display stability is analyzed combined with the wavelength drift characteristics of micro-LED devices.
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