范德瓦尔斯力
材料科学
聚合物
微电子
纳米技术
半导体
二硫化钼
单层
光电子学
复合材料
分子
化学
有机化学
作者
Ningxin Li,Tara Jabegu,Rui He,Seokjoon Yun,Sujoy Ghosh,Diren Maraba,Olugbenga Olunloyo,Hedi Ma,Aisha Okmi,Kai Xiao,Gangli Wang,Pei Dong,Sidong Lei
出处
期刊:Small
[Wiley]
日期:2024-02-25
标识
DOI:10.1002/smll.202310175
摘要
Van der Waals semiconductors (vdWS) offer superior mechanical and electrical properties and are promising for flexible microelectronics when combined with polymer substrates. However, the self-passivated vdWS surfaces and their weak adhesion to polymers tend to cause interfacial sliding and wrinkling, and thus, are still challenging the reliability of vdWS-based flexible devices. Here, an effective covalent vdWS-polymer lamination method with high stretch tolerance and excellent electronic performance is reported. Using molybdenum disulfide (MoS2 )and polydimethylsiloxane (PDMS) as a case study, gold-chalcogen bonding and mercapto silane bridges are leveraged. The resulting composite structures exhibit more uniform and stronger interfacial adhesion. This enhanced coupling also enables the observation of a theoretically predicted tension-induced band structure transition in MoS2 . Moreover, no obvious degradation in the devices' structural and electrical properties is identified after numerous mechanical cycle tests. This high-quality lamination enhances the reliability of vdWS-based flexible microelectronics, accelerating their practical applications in biomedical research and consumer electronics.
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