材料科学
微观结构
热电效应
维氏硬度试验
热电材料
电子迁移率
抗压强度
复合材料
光电子学
热导率
热力学
物理
作者
Kaikai Pang,Liya Miao,Qiang Zhang,Qiaoyan Pan,Yan Liu,Huilie Shi,Jingsong Li,Wenjie Zhou,Zongwei Zhang,Yuyou Zhang,Gang Wu,Xiaojian Tan,Jacques Noudem,Jiehua Wu,Peng Sun,Haoyang Hu,Guoqiang Liu,Jun Jiang
标识
DOI:10.1002/adfm.202315591
摘要
Abstract Bi 2 Te 3 ‐based alloys have historically dominated the commercial realm of near room‐temperature thermoelectric (TE) materials. However, the more widespread application is currently constrained by its mediocre TE performance and inferior mechanical properties resulting from intrinsic hierarchical structure. Herein, microstructure modulation and carrier transport optimization strategies are employed to efficiently balance the electro‐thermal transport performance. Specifically, the weighted mobility increases by 24%, while the lattice thermal conductivity decreases by 31% at 350 K compared to the matrix. Consequently, the Bi 0.5 Sb 1.496 Cu 0.004 Te 2.98 sample attains a peak ZT of 1.45 at 350 K and an average ZT of 1.20 (300–500 K). Moreover, intricated microstructure design, exemplified by the gradient twin structure, significantly enhances the mechanical performance metrics, including Vickers hardness, compressive strength, and bending strength, to notable levels of 0.94 GPa, 224 MPa, and 58 MPa, respectively. Consequently, the constructed 17‐pair TE modules demonstrate a maximum conversion efficiency of 6.5% at Δ T = 200 K, surpassing the majority of reported Bi 2 Te 3 ‐based modules. This study provides novel insights into the synergistic enhancement of TE and mechanical properties in Bi 2 Te 3 ‐based materials, with potential applicability to other TE systems.
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