电磁屏蔽
材料科学
电磁干扰
电磁干扰
导电体
光电子学
透射率
复合材料
薄板电阻
电气工程
图层(电子)
工程类
作者
Zibo Chen,Shaodian Yang,Junhua Huang,Yifan Gu,Weibo Huang,Shaoyong Liu,Zhiqiang Lin,Zhiping Zeng,Yougen Hu,Zimin Chen,Bo‐Ru Yang,Xuchun Gui
标识
DOI:10.1007/s40820-023-01295-z
摘要
Abstract Despite the growing demand for transparent conductive films in smart and wearable electronics for electromagnetic interference (EMI) shielding, achieving a flexible EMI shielding film, while maintaining a high transmittance remains a significant challenge. Herein, a flexible, transparent, and conductive copper (Cu) metal mesh film for EMI shielding is fabricated by self-forming crackle template method and electroplating technique. The Cu mesh film shows an ultra-low sheet resistance (0.18 Ω □ −1 ), high transmittance (85.8%@550 nm), and ultra-high figure of merit (> 13,000). It also has satisfactory stretchability and mechanical stability, with a resistance increases of only 1.3% after 1,000 bending cycles. As a stretchable heater ( ε > 30%), the saturation temperature of the film can reach over 110 °C within 60 s at 1.00 V applied voltage. Moreover, the metal mesh film exhibits outstanding average EMI shielding effectiveness of 40.4 dB in the X-band at the thickness of 2.5 μm. As a demonstration, it is used as a transparent window for shielding the wireless communication electromagnetic waves. Therefore, the flexible and transparent conductive Cu mesh film proposed in this work provides a promising candidate for the next-generation EMI shielding applications.
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