兴奋剂
材料科学
碳化硅
工程物理
光电子学
离子注入
半导体
杂质
晶体管
硅
离子
纳米技术
电气工程
电压
化学
冶金
工程类
有机化学
作者
Andrei Afanasev,Vladimir A. Ilyin,В. В. Лучинин
出处
期刊:Semiconductors
[Pleiades Publishing]
日期:2022-12-01
卷期号:56 (13): 472-486
被引量:6
标识
DOI:10.1134/s1063782622130024
摘要
Ion implantation is a key technology without alternative for doping silicon carbide SiC in the manufacturing processes of SiC devices. SiC technology has a number of distinctive features in comparison with Si-ion doping technology. This paper provides a systematic analysis of modern technical solutions aimed at the formation of local doped regions by the method of ion implantation for various purposes for SiC-based high-power electronic devices. The results of research conducted at the St. Petersburg State Electrotechnical University LETI are presented. This research is focused on the development and selection of modes of aluminum- and phosphorus-ion implantation into 4H-SiC structures that provide specified concentrations of doping impurities and geometric dimensions of local ion-doped regions. The developed ion-implantation modes are successfully implemented in the manufacture of samples of high-power 4H-SiC metal–insulator–semiconductor (MIS) transistors with operating voltages of up to 1200 V.
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