电磁屏蔽
材料科学
电磁干扰
制作
电磁干扰
电子设备和系统的热管理
导电体
数码产品
复合材料
光电子学
灵活性(工程)
热导率
机械工程
电气工程
工程类
医学
统计
替代医学
数学
病理
作者
Linxin Ran,Lijuan Qiu,Hong Zhao,Furong Sun,Zhiyi Chen,Lijuan Zhao,Longfei Yi,Xiaoling Ji
标识
DOI:10.1016/j.compositesa.2023.107672
摘要
The booming of modern communication and wearable electronics has greatly necessitated the development of films that could feature both electromagnetic interference shielding and thermal management capacity. Here we report a series of sandwich structured films prepared through freeze drying-laying-hot compression technology. Owing to the unique sandwich like structure, the resulting film has displayed not only EMI shielding performance (42 dB), but also enhanced absorption capacity (95 %). Meanwhile, strong anisotropic thermal conductive property that allows for satisfying in-plane thermal conductivity of 3.29 W m−1 K−1 was achieved. Benefiting from this, excellent electro-thermal conversion capacity that could enable fast de-icing under low voltage (4 V) was also acquired. Furthermore, those sandwich structured films possess sufficient flexibility to sustain repetitive bending, folding and shaping. Herein, this research has expanded the horizons in seeking both superior EMI shielding and heat dissipation capacity, which will further benefit the development of MXene‑based composites for high-performance electronic devices.
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