石墨烯
材料科学
硅
表面改性
异质结
热导率
界面热阻
基质(水族馆)
热传递
化学物理
声子
纳米技术
传热
光电子学
热阻
凝聚态物理
复合材料
化学工程
图层(电子)
热力学
化学
物理
海洋学
地质学
工程类
作者
Haiying Yang,Yinjie Shen,Lin Li,Yichen Pan,Ping Yang
标识
DOI:10.1016/j.applthermaleng.2023.121913
摘要
The aim of this article is to find a measure to improve the interfacial thermal transfer of graphene/silicon heterojunction. We propose an interfacial modification method to modify the surface of graphene/silicon heterojunction to improve the interfacial thermal conductivity. Through molecular dynamics simulation, we found that this modification method can significantly reduce the thermal resistance (ITR) of graphene/silicon interface. That is, the ITR reduction of Gr/Si can be induced by the introduction of holes on the silicon surface. In the meantime, the functionalization of substrate and methyl group can induce further reduction of ITR. When the methyl group is outside the silicon pore, the ITR reduction at the heterogeneous interface is greater than when the methyl group is inside the silicon pore. In addition, we use interface coupling intensity and phonon state density (PDOS) to analyze the internal mechanism of interfacial heat transport changes. The investigation shows that we can improve the ITR of Gr/Si heterointerface through surface modification.
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