Synergistic effect of positive temperature coefficient and thermally conductive micro‐nano fillers on electrical and thermal properties of epoxy resin

材料科学 环氧树脂 复合材料 纳米- 导电体 温度系数 热的 热膨胀 填料(材料) 物理 气象学
作者
Taqi ur Rahman,Xiangrong Chen,Tianyin Zhang,Qilong Wang,Kai Yin,Muhammad Awais,Ashish Paramane
出处
期刊:Polymer Composites [Wiley]
卷期号:45 (9): 8590-8600 被引量:2
标识
DOI:10.1002/pc.28362
摘要

Abstract This study investigates the effect of positive temperature coefficient (PTC) fillers, i.e., barium strontium titanate (BST‐60) and nano hexagonal boron nitride (h‐BN) fillers, on thermal and dielectric insulation properties of epoxy (EP). The electrical resistivity, DC breakdown strength, space charge, thermal conductivity, thermogravimetric analysis, and glass transition temperature ( T g ) of EP composites were measured. Results indicate that, below curie temperature, the EP composites containing 0.5 and 1 wt% of BST and 5 wt% of h‐BN have superior electrical resistivity, breakdown strength, and thermal conductivity. However, above curie temperature, the EP composites containing 2 and 2.5 wt% of BST and 5 wt% of h‐BN have superior insulation properties than the pure EP and other composites. While the thermal properties of EP improve with an increase in h‐BN loading to 10 wt%, its dielectric properties are slightly compromised due to the presence of tiny defects in the composite material. It is hypothesized that the BST‐60 suppresses the negative temperature coefficient effect (NTC) of EP by regulating the electrical resistivity above the curie point, whereas nano h‐BN enhances the thermal conductivity of EP by constructing a heat dissipation path. The proposed mechanism for charge dynamics along with heat conduction‐dissipation explains the fillers' behavior at different temperatures. Highlights Analysis of epoxy composites with polydopamine‐modified BST and h‐BN fillers. PTC fillers are used to mitigate the negative temperature effect of epoxy. Optimal fillers wt% improves dielectric and thermal properties. This study shows that optimized epoxy composites can be used for packaging.

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