材料科学
复合材料
消散
热导率
纳米片
传热
纳米技术
热力学
物理
作者
Hongqiang Wang,Yijie Liu,Shujing Zhong,Jie Chen,Zhe Li,Chongyin Zhang,Pingkai Jiang,Xingyi Huang
出处
期刊:Small
[Wiley]
日期:2024-04-28
标识
DOI:10.1002/smll.202400115
摘要
Abstract High‐power‐density electronic devices under vibrations call for soft and damping thermal interface materials (TIMs) for efficient heat dissipation. However, integrating low hardness, high damping, and superior heat transfer capability into one TIM is highly challenging. Herein, soft, damping, and thermally conductive TIMs are designed and prepared by constructing a honeycomb‐board‐mimetic boron nitride nanosheet (BNNS) network in a dynamic polyimine via one‐step horizontal centrifugal casting. The unique filler network makes the TIMs perform a high through‐plane thermal conductivity (> 7.69 W m −1 K −1 ) and a uniform heat transfer process. Meanwhile, the hierarchical dynamic bonding of the polyimine endows the TIMs with low compressive strength (2.16 MPa at 20% strain) and excellent damping performance (tan δ > ≈0.3 at 10 −2 –10 2 Hz). The resulting TIMs also exhibit electrical insulation and remarkable recycling ability. Compared with the commercial ones, the TIMs provide better heat dissipation (4.1 °C) for a high‐power 5G base station and less temperature fluctuation (1.8 °C) for an automotive insulated gate bipolar transistor (IGBT) under vibrations. This rational design offers a viable approach to prepare soft and damping TIMs for effective heat dissipation of high‐power‐density electronic devices under vibrations.
科研通智能强力驱动
Strongly Powered by AbleSci AI