Local bond-slip numerical simulation based on ANSYS contact analysis

This paper has conducted contact analysis of pull out specimens with FE code ANSYS10.0. A series of numerical simulation technologies such as defining material, establishing FE model, generating contact element and post-processing are studied. This paper has paid special attention to setting up 3-D contact pair with element TARGE170 and CONTA174. Both friction coefficient of Coulomb friction model and adhesion strength are recommended. Finally, bond-slip numerical simulation is carried out based on contact analysis. Contact friction, contact pressure and contact state can be studied by this method, which makes up the deficiency of macro test. Comparison with experiments shows that this method is feasible to simulate bond-slip relationship during pull-out test.