Polyimides have inherently high mechanical properties, good chemical resistance, a low dielectric constant and high thermal stability [1]. In recent years, polyimide-based sensor materials have received much attention due to their simple preparation method, chemical inertness, mechanical and thermal stability, and high biocompatibility[2–4]. Thus they have a wide range of diverse and potential applications in several major technologies. Among the polymers, polyimides (PI) possess reliable high-temperature stability, excellent chemical resistance, high hydrolytic stability, adhesive properties, and good mechanical strength [7– 9]. Polysulfones and phosphine oxidecontaining polyimides have excellent adhesive properties without sacrificing thermal stability [10–12].