Mussel-inspired strategy to construct 3D silver nanoparticle network in flexible phase change composites with excellent thermal energy management and electromagnetic interference shielding capabilities

材料科学 电磁屏蔽 聚乙二醇 复合材料 银纳米粒子 纳米颗粒 热导率 电磁干扰 纳米技术 化学工程 计算机科学 电信 工程类
作者
Yuan-yuan Xiao,Yingjie He,Ruiqing Wang,Yan-zhou Lei,Jing‐hui Yang,Xiao‐dong Qi,Yong Wang
出处
期刊:Composites Part B-engineering [Elsevier]
卷期号:239: 109962-109962 被引量:85
标识
DOI:10.1016/j.compositesb.2022.109962
摘要

Nowadays, efficient thermal management and electromagnetic interference shielding as effective measures for maintaining the normal operation of electronic devices are extremely significant. However, composites with both thermal management and electromagnetic interference shielding performance are rarely reported. In this study, a kind of flexible polydopamine (PDA) and silver nanoparticles (AgNPs) wrapped melamine foam (MF) constructed by adopting the mussel-inspired strategy was used to fabricate MPAχ-PEG phase change materials (PCMs) via encapsulating polyethylene glycol (PEG). PDA was selected to enhance the interface bonding between MF and AgNPs due to its strong adhesion based on mussel-inspired surface chemistry. Continuous AgNPs wrapped on skeleton of MF construct the three-dimensional (3D) thermal/electrical-conductive porous network. MPAχ-PEG PCMs exhibit a relatively high phase change enthalpy of 148.9 J/g and a high thermal conductivity enhancement of 1400% in comparison with that of MF-PEG. Moreover, MPAχ-PEG PCMs are provided with electromagnetic interference (EMI) shielding performance with the mean SET of 82.02 dB and electro-to-thermal energy conversion efficiency (86.3% under the voltage of 1.2 V) due to the 3D conductive AgNPs network. Combining the elasticity of MPAχ foams and the phase change feature of PEG, the MPAχ-PEG PCMs show good solar-induced shape memory performance. The flexible PCMs could avoid the sharp temperature increase of smartphone by the solid-liquid phase change process of PEG. Therefore, this study provides a promising strategy to prepare flexible PCMs, which can achieve various forms of energy conversion, as well as thermal management and EMI shielding performance, can definitely broaden their application prospect in electronic devices.
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