High Throughput Studies on Irradiated High Entropy Alloys

图书馆学 历史 艺术史 媒体研究 社会学 计算机科学
作者
Mukesh Bachhav,Benoît Queylat,Michael Moorehead,Daniel B. Murray,Calvin Parkin,Nathan Curtis,Phalgun Nelaturu,Dane Thoma,Dane Morgan,Adrien Couet
出处
期刊:Microscopy and Microanalysis [Oxford University Press]
卷期号:28 (S1): 2100-2101
标识
DOI:10.1017/s1431927622008121
摘要

Journal Article High Throughput Studies on Irradiated High Entropy Alloys Get access Mukesh Bachhav, Mukesh Bachhav Idaho National Laboratory, Idaho Falls, ID, USA Corresponding author: Mukesh.Bachhav@inl.gov Search for other works by this author on: Oxford Academic Google Scholar Benoit Queylat, Benoit Queylat University of Wisconsin, Madison, WI, USA Search for other works by this author on: Oxford Academic Google Scholar Michael Moorehead, Michael Moorehead Idaho National Laboratory, Idaho Falls, ID, USA Search for other works by this author on: Oxford Academic Google Scholar Daniel Murray, Daniel Murray Idaho National Laboratory, Idaho Falls, ID, USA Search for other works by this author on: Oxford Academic Google Scholar Calvin Parkin, Calvin Parkin University of Wisconsin, Madison, WI, USA Search for other works by this author on: Oxford Academic Google Scholar Nathan Curtis, Nathan Curtis University of Wisconsin, Madison, WI, USA Search for other works by this author on: Oxford Academic Google Scholar Phalgun Nelaturu, Phalgun Nelaturu University of Wisconsin, Madison, WI, USA Search for other works by this author on: Oxford Academic Google Scholar Dane Thoma, Dane Thoma University of Wisconsin, Madison, WI, USA Search for other works by this author on: Oxford Academic Google Scholar Dane Morgan, Dane Morgan University of Wisconsin, Madison, WI, USA Search for other works by this author on: Oxford Academic Google Scholar Adrien Couet Adrien Couet University of Wisconsin, Madison, WI, USA Search for other works by this author on: Oxford Academic Google Scholar Microscopy and Microanalysis, Volume 28, Issue S1, 1 August 2022, Pages 2100–2101, https://doi.org/10.1017/S1431927622008121 Published: 01 August 2022

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