Experimental design of composite films with thermal management and electromagnetic shielding properties based on polyethylene glycol and MXene

Based on the broad scope of applications in electronics, the development requirements of excellent electronic packaging materials with efficient thermal management performance and high electromagnetic interference shielding effectiveness (EMI SE) are critical, while which are also hardly compatible for a single material such as an elementary substance or a simple chemical compound. Therefore, a series of novel composites filled with phase change material (PCM) polyethylene glycol (PEG) were developed with MXene as the skeleton, and flame retardant Mg(OH)2 was added to achieve flame retardancy for composites under high temperature environment. As a result, the prepared MXene@PEG/Mg(OH)2 in this work could achieve an excellent EMI SE of 38.8 dB in X-band, and the thermal conductivity rose from 0.26 to 0.95 W/m·K, while the composite film also presented certain mechanical properties, with the latent heat of 153.72 J/g. Furthermore, the shape stability of the composite material was favourable due to the capillary function of MXene, which effectively forbade the leakage behavior of PCMs during solid-liquid phase transition. The design of MXene@PEG/Mg(OH)2 composite with stable structure provided a new idea for manufacturing EMI SE materials which often exposed to electromagnetic radiation, which indicated potential great significance for a new generation of packaging materials application in electronic equipment field.