光电二极管
图像传感器
光电子学
材料科学
薄脆饼
CMOS芯片
硅
光电探测器
兴奋剂
绝缘体上的硅
CMOS传感器
计算机科学
人工智能
作者
Hee-Chang Jang,Henry Hinton,Woo‐Bin Jung,Min‐Hyun Lee,Changhyun Kim,Min Park,Seoung‐Ki Lee,Seongjun Park,Donhee Ham
标识
DOI:10.1038/s41928-022-00819-6
摘要
Complementary metal–oxide–semiconductor (CMOS) image sensors allow machines to interact with the visual world. In these sensors, image capture in front-end silicon photodiode arrays is separated from back-end image processing. To reduce the energy cost associated with transferring data between the sensing and computing units, in-sensor computing approaches are being developed where images are processed within the photodiode arrays. However, such methods require electrostatically doped photodiodes where photocurrents can be electrically modulated or programmed, and this is challenging in current CMOS image sensors that use chemically doped silicon photodiodes. Here we report in-sensor computing using electrostatically doped silicon photodiodes. We fabricate thousands of dual-gate silicon p–i–n photodiodes, which can be integrated into CMOS image sensors, at the wafer scale. With a 3 × 3 network of the electrostatically doped photodiodes, we demonstrate in-sensor image processing using seven different convolutional filters electrically programmed into the photodiode network. A network of dual-gate silicon p–i–n photodiodes, which are compatible with complementary metal–oxide–semiconductor fabrication processes, can perform in-sensor image processing by being electrically programmed into convolutional filters.
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