Growth Kinetics of Interfacial Intermetallic Compound in Al(AA4343)/Steel(SUS316) Clad Strip

The composition and microstructure of intermetallic compounds (IMC) at the interface of aluminum(AA4343)-stainless steel(SUS316) were studied upon annealing at 550°C for 1h to 20h and at 610°C for 15min to 10h by means of optical microscope(OM) , scanning electron microscope (SEM) with energy dispersive system(EDS) and transmission Electron Microscopy (TEM). The results showed that the IMC was of 4.3μm to 36.1μm thick during heat treatment at 550°C for 1h to 20h, and the IMC contained Al-Fe-Si-Cr-Ni-Mo and Al-Fe-Si -Ni. During annealing at 610°C for 15min to 5h, the thickness of IMC was 31.2 μm to 208 μm, and the IMC were mainly of η-Fe 2 Al 5 and τ 10 - Al 4 Fe 1.7 Si at 550°C for 10h. As the annealing time extended to 10h, natural delamination occurred at the interface between the aluminum alloy layer and IMC layer. The growth kinetics analysis showed that the relationship between the thickness of IMC “ X ” and time “ t ” followed the relational equation X=(kt) n . For AA4343(solid) - SUS316(solid), n was 1/2, and the growth constant k = 1.9×10 -13 m 2 /s at annealing temperature of 550 °C. When the temperature was 610°C, AA4343 - SUS316 was a liquid-solid contact reaction, n was 1, the growth constant k=1.45×10 -8 m/s .