铜
材料科学
分析器
冶金
图层(电子)
涂层
热导率
原材料
表征(材料科学)
电导率
复合材料
纳米技术
化学
色谱法
物理化学
有机化学
作者
Xiao Yun Zhu,Lie Hu,Dong Man
出处
期刊:Key Engineering Materials
日期:2012-06-01
卷期号:512-515: 141-146
标识
DOI:10.4028/www.scientific.net/kem.512-515.141
摘要
This paper presents the process of preparing spherical silver-coated copper powder with a silver content of 30-50%, using chemical reduction and by adjusting the silver-coating process. By means of SEM, XRD, grain size analyser, digital ohmmeter and differential thermal analyser, the surface topology, structure and conductivity of silver-coated copper powder and raw copper powder are characterised. The results show that the spherical silver-coated copper powder has superior compact surface, complete coverage, a coated layer reaching a thickness of 336nm and excellent conductivity and anti-oxidation property.
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